Custom 4-layer Black Soldermask PCB with BGA

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  • Custom 4-layer Black Soldermask PCB with BGA

PRODUCTS DETAILS

Base Material: FR4 TG170+PI
PCB Thickness: Rigid: 1.8+/-10%mm, flex: 0.2+/-0.03mm
Layer Count: 4L
Copper Thickness: 35um/25um/25um/35um
Surface Treatment: ENIG 2U”
Solder Mask: Glossy green
Silkscreen: White
Special Process: Rigid+flex
At present, BGA technology has been widely used in the computer field (portable computer, supercomputer, military computer, telecommunication computer), communication field (pagers, portable phones, modems), automotive field (various controllers of automobile engines, automobile entertainment products). It is used in a wide variety of passive devices, the most common of which are arrays, networks and connectors. Its specific applications include walkie-talkie, player, digital camera and PDA, etc.

The Future of BGA Package of PCB

Due to the reasons of cost effectiveness and durability, the BGA packages will be more and more popular in the electrical and electronic product markets in the future. Furthermore, there are a lot of different BGA package types were developed to meet different requirements in the PCB industy, and there are a lot of great advantages by using this technology, so we could really expect a bright future by using the BGA package, if you have the requirement, please feel free to contact us.

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