Base Material:	FR4 TG150
PCB Thickness:	1.6+/-10%mm
Layer Count:	8L
Copper Thickness:	1 oz for all the layers
Surface treatment:	HASL-LF
Solder mask:	Glossy green
Silkscreen:	White
Special process :	Standard

Let's introduce some knowledge of pcb copper thickness. Copper foil as pcb conductive body, easy adhesion to the insulation layer, corrosion form circuit pattern.The thickness of copper foil is expressed in oz(oz), 1oz=1.4mil, and the average thickness of copper foil is expressed in weight per unit area by the formula: 1oz=28.35g/ FT2(FT2 is square feet, 1 square foot =0.09290304㎡). International pcb copper foil commonly used thickness: 17.5um, 35um, 50um, 70um. Generally, customers do not make special remarks when making pcb. The copper thickness of single and double sides is generally 35um, that is, 1 amp copper. Of course, some of the more specific boards will use 3OZ, 4OZ, 5OZ... 8OZ, etc., according to product requirements to choose the appropriate copper thickness. The general copper thickness of single and double sided PCB board is about 35um, and the other copper thickness is 50um and 70um. The surface copper thickness of the multilayer plate is generally 35um, and the inner copper thickness is 17.5um. The use of Pcb board copper thickness mainly depends on the use of PCB and signal voltage, current size, 70% of the circuit board uses 3535um copper foil thickness. Of course, for the current is too large circuit board, copper thickness will also be used 70um, 105um, 140um(very few) Pcb board use is different, the use of copper thickness is also different. Like common consumer and communications products, use 0.5oz, 1oz, 2oz; For most of the large current, such as high voltage products, power supply board and other products, generally use 3oz or above is thick copper products. The lamination process of circuit boards is generally as follows: 1. Preparation: Prepare the laminating machine and the required materials (including circuit boards and copper foils to be laminated, pressing plates, etc.). 2. Cleaning treatment: Clean and deoxidize the surface of the circuit board and copper foil to be pressed to ensure good soldering and bonding performance. 3. Lamination: Laminate the copper foil and the circuit board according to the requirements, usually one layer of circuit board and one layer of copper foil are stacked alternately, and finally a multi-layer circuit board is obtained. 4. Positioning and pressing: put the laminated circuit board on the pressing machine, and press the multi-layer circuit board by positioning the pressing plate. 5. Pressing process: Under predetermined time and pressure, the circuit board and copper foil are pressed together by a pressing machine so that they are tightly bonded together. 6. Cooling treatment: Put the pressed circuit board on the cooling platform for cooling treatment, so that it can reach a stable temperature and pressure state. 7.Subsequent processing: Add preservatives to the surface of the circuit board, perform subsequent processing such as drilling, pin insertion, etc., to complete the entire production process of the circuit board.